DEPA.V3D(Cu) is a volatile liquid medium specially developed for punching, punching and rolling of copper and copper alloy sheets. The elected synthetic solvent combination can volatilize naturally after processing, leaving only a very thin protective film to protect the workpiece from corrosion. This protective film does not need to be cleaned in most post-processing procedures. 

DEPA.V3D (Cu) has been widely used for stamping copper sheet of electrical connectors, and also for thin sheet metal such as aluminum sheet, stainless steel sheet and galvanized sheet.

Advantages

● Premium solvent base with gentle smell and no harmful to skin.

● Shortest drying time.

● Special additives provide superior lubricity and reduce tool wear.

● Eliminate the degreasing process and save the manufacturing cost directly. 

Typical Data

While the information and figures given here are typical of current production and confirm to specification, minor variations may occur. No warranty expressed or implied is given concerning the accuracy of the information or the suitability of the products.